AUSTIN, Texas--(BUSINESS WIRE)--Accelsius™, whose proprietary two-phase, direct-to-chip liquid cooling systems enable high-performance computing and rack density for data center and edge operators, announced today the successful raise of $24 million pursuant to a Series A funding round. The Series A funding round started in early 2024. “This investment is a testament to our team’s intense focus on operational innovation and technological ingenuity,” said Josh Claman, Accelsius’ CEO. “We believe...
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